Method for manufacturing electornic device

ABSTRACT

Provided is a method of manufacturing an electronic device. An electronic device having excellent moisture blocking property and durability may be provided by the method.

BACKGROUND

1. Field of the Invention

The present invention relates to a method of manufacturing an electronicdevice.

2. Discussion of Related Art

The electronic diode or device may be protected by an encapsulating filmsince it is sensitive to an external factor such as moisture or oxygen.The diode or device which may be protected by the encapsulating film mayinclude, for example, an organic electronic device, a solar cell or asecondary battery such as a lithium secondary battery may be included.Particularly, among the diodes or devices, the organic electronic deviceis vulnerable to an external factor such as moisture or oxygen.

The organic electronic device is a device including a functional organicmaterial. As the organic electronic device or an organic electronicdiode included in the organic electronic device, a photovoltaic device,a rectifier, a transmitter or an organic light emitting diode (OLED) maybe used.

The organic electronic device is generally vulnerable to an externalfactor such as moisture. For example, the OLED usually includes a layerof a functional organic material present between a pair of electrodesincluding a metal or metal oxide, and the layer of an organic materialis detached due to an effect of moisture penetrating from an externalenvironment at an interface with the electrode, is increased inresistance value due to oxidation of an electrode by moisture, or isdegenerated, thereby causing problems such as a loss of an emissivefunction or a decrease in luminescence.

SUMMARY OF THE INVENTION

The present invention is directed to providing a method of manufacturingan electronic device.

One aspect of the present invention provides a method of manufacturingan electronic device that comprises laminating an encapsulating film inwhich a first layer and a second layer are stacked on a diode such thatthe second layer is in contact with the diode. The method ofmanufacturing an electronic device can provide a device having excellentmoisture blocking property by using the encapsulating film in which thefirst and second layers are stacked.

Hereinafter, the encapsulating film will be described.

The encapsulating film may include at least one of each of the first andsecond layers, and further include a separate layer in addition to thefirst and second layers.

In one example, the first layer may include a pressure-sensitiveadhesive (PSA) component, and the second layer may include an adhesivecomposition.

The term “pressure-sensitive adhesive component (PSA)” used herein mayrefer to a component which ensures stickiness at room temperature, isadhered by supply of a pressure and not activated by heat, water or asolvent, exhibits a strong maintaining strength after adhesion, andensures a cohesive strength and elasticity. The term “adhesivecomponent” used herein may refer to a component capable of, unlike thePSA component, providing a permanent adhesion rather than a temporaryadhesion, that is, a composition generally present in a liquid phase tobe applied to adhere, solidified, cooled or cured, thereby exhibiting anadhesive strength, and physically destroyed when an object to be adheredafter adhesion is separated.

The encapsulating film includes first and second layers having differentphysical properties and/or components. The film may be laminated on adiode without bubbles even when applied to a large-scale device toprotect the diode, and effectively protect the diode from an externalfactor, for example, moisture, after encapsulation. The encapsulatingfilm may have various structures such as a structure in which a secondlayer 11 is disposed on one surface of a first layer 12 as shown inFIG. 1. Here, the structure in which the first layer 12 and the secondlayer 11 are stacked may include a structure in which the second layer11 is directly attached to the first layer 12, and a structure in whichthe second layer 11 is indirectly attached to the first layer 12 viaanother additional layer.

In the encapsulating film, the first layer may have a lower elasticmodulus than the second layer. For example, the tensile modulus of thefirst layer may be lower than that of the second layer. Unlessparticularly defined otherwise, the tensile modulus used herein ismeasured at 25° C. In addition, the tensile modulus with respect to acurable component used herein is, unless particularly defined otherwise,a tensile modulus measured after curing.

When the elastic modulus of the first layer is lower than that of thesecond layer, the encapsulating film is preferable to be applied to alarge-scale device, and an effective moisture blocking property can beprovided to the film as result of controlling a ratio of a moisturescavenger between the first and second layers. The term “moisturescavenger” used herein may refer to a material capable of removingmoisture or vapor penetrating the encapsulating film through a chemicalreaction with the water or vapor. Usually, when the moisture scavengeris reacted with moisture in the film, a volume expands to the extent ofthe reaction with moisture, thereby generating a stress. Accordingly, ifthe tensile modulus is not sufficient to reduce an expansion stressgenerated during the removal of moisture, the film may be detached froman adherent or induce inter-layer detachment in the case of a multilayerstructure. For example, when the elastic modulus of the film iscontrolled to decrease, the detachment due to the stress may beprevented. However, when the elastic modulus is controlled by reducing aglass transition temperature through simply controlling a curing degree,a water vapor transmission rate (WVTR) of the film may be increased.However, when two layers having different elastic moduli are stacked anda moisture scavenger is mainly included in the layer having a lowerelastic modulus of the two layers as described above, moisturepenetrating through the layer having a relatively smaller amount of themoisture scavenger, that is, the layer having a higher elastic modulus,may be diffused to the layer having a lower elastic modulus, therebyenhancing a moisture blocking property. In addition, other physicalproperties such as durability of the film may also be satisfied. In oneexample, the tensile modulus of the first layer may be approximately0.001 to 100 Mpa, 0.001 to 80 Mpa, 0.001 to 60 Mpa, 0.001 to 40 Mpa,0.001 to 20 Mpa, 0.001 to 10 Mpa, 0.001 to 5 Mpa, 0.001 to 3 Mpa, 0.001to 1 Mpa, 0.005 to 100 Mpa, 0.01 to 100 Mpa, 0.05 to 100 Mpa, 0.1 to 100Mpa, 0.2 to 100 Mpa, 0.3 to 100 Mpa, 0.005 to 80 Mpa, 0.01 to 60 Mpa,0.05 to 40 Mpa, 0.05 to 20 Mpa, 0.1 to 10 Mpa, 0.1 to 5 Mpa, 0.2 to 3Mpa or 0.3 to 1 Mpa. In addition, the tensile modulus of the secondlayer may be approximately 200 to 1000 Mpa, 300 to 1000 Mpa, 300 to 900Mpa, 300 to 800 Mpa, 300 to 700 Mpa, 400 to 1000 Mpa, 500 to 1000 Mpa,550 to 1000 Mpa, 400 to 900 Mpa, 500 to 800 Mpa or 550 to 700 Mpa. Inthe above range, the first layer may have a lower elastic modulus thanthe second layer. For example, a ratio (M1/M2) of the tensile modulus(M1) of the first layer to the tensile modulus (M2) of the second layermay be approximately 1×10⁻⁶ to 0.5, 1×10⁻⁶ to 0.4, 1×10⁻⁶ to 0.3, 1×10⁻⁶to 0.2, 10×10⁻⁶ to 0.5, 100×10⁻⁶ to 0.5, 200×10⁻⁶ to 0.5, 300×10⁻⁶ to0.5, 400×10⁻⁶ to 0.5, 500×10⁻⁶ to 0.5, 10×10⁻⁶ to 0.4, 100×10⁻⁶ to 0.4,200×10⁻⁶ to 0.3, 300×10⁻⁶ to 0.3, 400×10⁻⁶ to 0.2 or 500×10⁻⁶ to 0.2. Inthe relationship of the elastic modulus described above, theencapsulating film may also be effectively applied to a large-scaledevice, and easily controlled in a ratio of the moisture scavengerbetween the layers, which is preferable to control physical propertiesof the film.

In one example, the encapsulating layer may include a moisturescavenger. In this case, the first layer may include a larger amount ofmoisture scavenger than the second layer. The second layer may include asmaller amount of the moisture scavenger than the first layer, or maynot include the moisture scavenger. As will be described later, in theabove structure, for example, when the second layer has an encapsulatingstructure is realized such that the second layer is in contact with adiode, the diode may not be damaged, and an excellent moisture or vaporblocking property may be exhibited. For example, the first layer mayinclude a moisture scavenger at 5, 10, 20 or 25 parts by weight or morewith respect to 100 parts by weight of the PSA component. The upperlimit of the ratio of the moisture scavenger in the first layer may bechanged according to a desired moisture blocking property, and the firstlayer may include a moisture scavenger at 250, 230 or 210 parts byweight or less with respect to the PSA component, but the presentinvention is not particularly limited thereto. The second layer may notinclude the moisture scavenger, or otherwise may include a trace amountof the moisture scavenger. The second layer may include the moisturescavenger, for example, at less than 5 or 3 parts by weight with respectto 100 parts by weight of a solid content of the second layer. Since thesecond layer may not include a moisture scavenger, the lower limit ofthe content of the moisture scavenger in the second layer may be 0 partsby weight. Unless particularly defined otherwise, the unit “parts byweight” used herein refers to a weight ratio.

Thicknesses of the first and second layers may be controlled inconsideration of the number of layers included in the film or a use ofthe film. For example, when the film includes one of each of the firstand second layers, the thickness of the first layer may be approximately5 to 100 μm, and the thickness of the second layer may be approximately2 to 30 μm. In this range, the film having excellent moisture blockingproperty, workability and durability may be provided.

In one example, the first layer may include a PSA component having acontact angle of 80, 85, 90 or 95 degrees or more with respect todeionized water. The contact angle is a contact angle measured after alayer is formed by coating a glass with a solution containingapproximately 15 wt % of a solid content prepared by dissolving the PSAcomponent for the first layer in a suitable solvent and drying thecoated solution, and deionized water is dropped onto the coating layerat approximately 25° C., and may be an average of contact anglesmeasured by repeating the above process 10 times. As the component whosecontact angle is controlled as described above is included in the firstlayer, the film having excellent moisture blocking property anddurability may be provided. The upper limit of the contact angle of thePSA component may be, but is not particularly limited to, for example,150 or 120 degrees or less.

The first layer may also include a PSA component having a WVTR of 50 or45 g/m²·day or less. The WVTR may be measured in a thickness directionof the film which is formed from the PSA component to have a thicknessof 100 μm at 100° F. and a relative humidity of 100%. As the WVTR of thePSA component is controlled as described above, the film having anexcellent moisture blocking property may be provided. As the WVTR of thefirst layer is lower, the film may have a better moisture blockingproperty, and thus the lower limit thereof is not particularly limited.For example, the lower limit of the WVTR of the PSA component may be 0g/m²·day.

In one example, the PSA component included in the first layer maysatisfy all of the above ranges of the contact angle and WVTR. As thefirst layer includes the component having the above ranges of thecontact angle and WVTR, the film having excellent moisture blockingproperty and water repellency may be provided.

As the PSA component, any one of known components in the related artproviding a first layer satisfying the above-mentioned contact angle andWVTR or the above-mentioned elastic modulus can be used withoutparticular limitation. In addition, if a resin does not satisfy thecontact angle and WVTR alone, but satisfies the contact angle and WVTRin combination with another resin, the combined resin may be used as thePSA component.

The component may be a styrene-based resin, a polyolefin-based resin, athermoplastic elastomer, a polyoxyalkylene-based resin, apolyester-based resin, a polyvinyl chloride-based resin, apolycarbonate-based resin, a polyphenylenesulfide-based resin, a mixtureof hydrocarbons, a polyamide-based resin, an acrylate-based resin, anepoxy-based resin, a silicon-based resin, a fluorine-based resin or amixture thereof.

Here, the styrene-based resin may be, for example, astyrene-ethylene-butadiene-styrene block copolymer (SEBS), astyrene-isoprene-styrene block copolymer (SIS), anacrylonitrile-butadiene-styrene block copolymer (ABS), anacrylonitrile-styrene-acrylate block copolymer (ASA), astyrene-butadiene-styrene block copolymer (SBS), a styrene-basedhomopolymer or a mixture thereof. The olefin-based resin may be, forexample, a high-density polyethylene-based resin, a low-densitypolyethylene-based resin, a polypropylene-based resin or a mixturethereof. The thermoplastic elastomer may be, for example, an ester-basedthermoplastic elastomer, an olefin-based thermoplastic elastomer or amixture thereof. Among these, the olefin-based thermoplastic elastomermay be a polybutadiene resin or a polyisobutene resin. Thepolyoxyalkylene-based resin may be, for example, apolyoxymethylene-based resin, a polyoxyethylene-based resin or a mixturethereof. The polyester-based resin may be, for example, a polyethyleneterephthalate-based resin, a polybutylene terephthalate-based resin or amixture thereof. The polyvinylchloride-based resin may be, for example,a polyvinylidene chloride. The mixture of hydrocarbons may be, forexample, hexatriacotane or paraffin. The polyamide-based resin may be,for example, nylon. The acrylate-based resin may be, for example, apolybutyl(meth)acrylate. The epoxy-based resin may be, for example, abisphenol type such as a bisphenol A-, bisphenol F—, or bisphenol S-typeepoxy-based resin or a hydrogenated product thereof; a novolac type suchas a phenolnovolac- or cresolnovolac-type epoxy-based resin; anitrogen-containing cyclic type such as a cyclictriglycidylisocyanurate- or hydantoin-type epoxy-based resin; analicyclic type; an aliphatic type; an aromatic type such as anaphthalene-type epoxy-based resin or a biphenyl-type epoxy-based resin;a glycidyl type such as a glycidylether-type epoxy-based resin, aglycidylamine-type epoxy-based resin, or a glycidylester-typeepoxy-based resin; a dicyclo type such as dicyclopentadiene-typeepoxy-based resin; an ester type; an etherester type; or a mixturethereof. The silicon-based resin may be, for example, apolydimethylsiloxane. In addition, the fluorine-based resin may be apolytrifluoroethylene resin, a polytetrafluoroethylene resin, apolychlorotrifluoroethylene resin, a polyhexafluoropropylene resin, apolyvinylidene fluoride, a polyvinyl fluoride, a polyethylene propylenefluoride or a mixture thereof.

The resin may be grafted with maleic acid anhydride, copolymerized withanother resin listed above or a monomer for preparing a resin, ormodified by another compound, which may be a carboxyl-terminal endbutadiene-acrylonitrile copolymer.

In addition, the listed resin may include at least one heat-curablefunctional group or site such as a glycidyl, isocyanate, hydroxyl,carboxyl or amide group, or at least one active energy ray-curablefunctional group or site such as an epoxide, cyclic ether, sulfide,acetal or lactone group to exhibit a suitable cohesive strength aftercuring.

In one example, the first layer may include a polyisobutene resin. Thepolyisobutene resin may exhibit low WVTR and surface energy due tohydrophobicity. Particularly, the polyisobutene resin may be, forexample, a homopolymer of an isobutylene monomer; or a copolymerprepared by copolymerizing another monomer which can be polymerized withan isobutylene monomer. Here, the monomer which can be polymerized withan isobutylene monomer may be, for example, 1-butene, 2-butene, isopreneor butadiene.

The PSA component may be a resin having a weight average molecularweight (Mw) at which it can be molded in a film type. In one example,the range of the weight average molecular weight at which molding in afilm type is possible may be approximately 100,000 to 2,000,000, 100,000to 1,500,000 or 100,000 to 1,000,000. The term “weight average molecularweight (Mw)” used herein refers to a conversion value with respect to astandard polystyrene measured by gel permeation chromatography (GPC).

In addition, as the PSA component, one or at least two of the aboveresins may be used. When at least two resins are used, the resins may bedifferent in kind, weight average molecular weight or both.

The first layer may further include a moisture scavenger in addition tothe PSA component. Thus, the moisture blocking property of the firstlayer may be more enhanced.

In one example, the moisture scavenger may be present in a uniformlydispersed state in the PSA component. Here, the uniformly dispersedstate may refer to a state in which the moisture scavenger is present atthe same or substantially the same density in any part of the PSAcomponent. The moisture scavenger capable of being used herein may be,for example, a metal oxide, a sulphate or an organic metal oxide.Particularly, the metal oxide may be magnesium oxide, calcium oxide,strontium oxide, barium oxide or aluminum oxide, the sulphate may bemagnesium sulphate, sodium sulphate or nickel sulphate, and the organicmetal oxide may be aluminum oxide octylate. The moisture scavenger whichmay be included in the first layer may use one or at least two of theabove materials. In one example, when at least two materials are usedfor the moisture scavenger, calcined dolomite may be used.

Such a moisture scavenger may be controlled in a suitable size accordingto a use of the film. In one example, an average particle diameter ofthe moisture scavenger may be controlled to approximately 10 to 15,000nm. Since a response rate with moisture is not excessively high, themoisture scavenger having a size within the above range may be easilystored, may not damage a diode to be encapsulated, and may effectivelyremove moisture.

A content of the moisture scavenger may be controlled to, for example, 5to 250 parts by weight with respect to 100 parts by weight of the PSAcomponent as described above.

In addition, in one example, the first layer may further include adispersing agent such that the moisture scavenger is uniformly dispersedin the PSA component. As the dispersing agent capable of being usedherein, a non-ionic surfactant having an affinity to a hydrophilicsurface of the moisture scavenger and a compatibility with the PSAcomponent may be used. In one example, as the non-ionic surfactant, acompound represented by Formula 1 may be used.

R—X  [Formula 1]

In Formula 1, R is a saturated or unsaturated hydrocarbon group, and Xis a hydroxyl group, a carboxyl group, an amino group or a carbohydrateresidue.

In Formula 1, R may be a saturated or unsaturated hydrocarbon grouphaving 4 to 28, 4 to 24, 4 to 20 or 6 to 20 carbon atoms.

In addition, the compound of Formula 1 in which X is a carbohydrateresidue may refer to a compound in which one of hydrogen atoms in thecarbohydrate is substituted with R. The carbohydrate may be, forexample, glucose.

The compound of Formula 1 may be, for example, a fatty acid such asstearic acid, palmitic acid, oleic acid or linoleic acid; a fattyalcohol such as cetyl alcohol, stearyl alcohol, cetostearyl alcohol oroleyl alcohol; or an alkyl glucoside such as octyl glucoside, decylglucoside or lauryl glucoside.

A content of the dispersing agent may be controlled according to thekind and/or size of a moisture scavenger. Particularly, as the size ofthe moisture scavenger is decreased, a surface area of the moisturescavenger is increased, and thus a large amount of the dispersing agentis needed to uniformly disperse the moisture scavenger. In one example,when a moisture scavenger having an average particle diameter ofapproximately 40 nm is used, approximately 5 parts by weight of thedispersing agent may be used based on 100 parts by weight of themoisture scavenger. In one example, when a moisture scavenger having anaverage particle diameter of approximately 1,000 nm is used,approximately 0.05 parts by weight of the dispersing agent may be usedbased on 100 parts by weight of the moisture scavenger. Accordingly, inconsideration of the above-described kind and/or size of the moisturescavenger, approximately 0.01 to 500 parts by weight of the dispersingagent may be used based on 100 parts by weight of the moisturescavenger. In this range, the moisture scavenger may be uniformlydispersed with no influence on any physical properties including anadhesive strength of the film.

A method of including the moisture scavenger and the dispersing agent inthe first layer may be any method used in the related art withoutparticular limitation, and may be a method capable of uniformlydispersing the moisture scavenger in the PSA component by controlling amixing sequence. First, a dispersing solution is prepared by dispersingthe dispersing agent in a solvent. Here, the solvent may be selectedbased on coatability, drying temperature or compatibility with the PSAcomponent. In one example, when the polyisobutene resin is used as thePSA component, an aromatic solvent such as toluene or xylene may be usedas a solvent. The moisture scavenger is added to and mixed with thedispersing solution. Here, as the process of mixing the moisturescavenger with the dispersing solution, a physical dispersion method mayfurther be used to increase dispersity of the moisture scavenger. Thephysical dispersion method may be, for example, a method using a shaker,sonication or bead milling. A composition for forming the first layermay be obtained by adding the solution in which the moisture scavengerand the dispersing agent are dispersed to a solution including the PSAcomponent. The solution in which the moisture scavenger and thedispersing agent are dispersed may be optionally filtered to screenlarge-sized particles, and then the filtered solution may be added tothe solution including the PSA component. Through the above process, thefirst layer in which the moisture scavenger and the dispersing agent areuniformly dispersed in the PSA component may be formed. However, theprocess is not limited to that described above, and will be simplymodified by one of ordinary skill in the art.

The first layer may further include a moisture blocker. The term“moisture blocker” used herein may refer to a material having no or lowreactivity to moisture penetrating the film, but capable of preventingor interrupting migration of moisture or vapor into the film. As themoisture blocker, one or at least two of clay, talc, needle-shapedsilica, planar silica, porous silica, zeolite, titania or zirconia maybe used. In addition, the moisture blocker may be surface-treated by anorganic modifier to facilitate penetration of an organic material. Theorganic modifier may be, for example, dimethyl benzyl hydrogenatedtallow quaternary ammonium, dimethyl dihydrogenated tallow quaternaryammonium, methyl tallow bis-2-hydroxyethyl quaternary ammonium, dimethylhydrogenated tallow 2-ethylhexyl quaternary ammonium, dimethyldehydrogenated tallow quaternary ammonium or a mixture thereof.

A content of the moisture blocker that may be included in the firstlayer may be suitably controlled in the relationship with a matrixstructure of the moisture scavenger and the PSA component. In oneexample, the content of the moisture blocker may be controlled to 0 to50 parts by weight or 1 to 30 parts by weight with related to 100 partsby weight of the PSA component. In this range, the film having excellentmoisture blocking property and mechanical properties may be provided.

In one example, the moisture scavenger and the moisture blocker may beuniformly dispersed in the PAS component by controlling the mixingsequence of the component for the first layer even when the first layerincludes both the moisture scavenger and the moisture blocker.

For example, first, a first dispersing solution may be prepared byadding the moisture blocker to a solvent. Here, the first dispersingsolution may be obtained in a dispersing solution in which the moistureblocker is uniformly dispersed through a process such as sonication,bead milling, ball milling, high-speed dispersion or high-pressuredispersion. Separately, as described above, a second dispersing solutionin which the moisture scavenger and/or dispersing agent is (are)dispersed is prepared. The prepared first and second dispersingsolutions are added to and mixed with the solution including the PSAcomponent. During mixing, in consideration of the control in viscosityand coatability of the resin composition, a solvent may further beadded. According to the method described above, the first layer in whichthe moisture scavenger and the blocker are uniformly dispersed may beformed. The method of forming the first layer can be changed with regardto aspects well known to one of ordinary skill in the art withoutlimitation.

The first layer may further include a tackifier. As the tackifier, forexample, a hydrogenated petroleum resin obtained by hydrogenating apetroleum resin may be used. The hydrogenated petroleum resin may be apartially or completely hydrogenated resin, or a mixture of such resins.As the tackifier, one having a good compatibility with the PSA componentand an excellent moisture blocking property may be selected. Aparticular example of the hydrogenated petroleum resin may be ahydrogenated terpene-based resin, a hydrogenated ester-based resin or ahydrogenated dicyclopentadiene-based resin. The tackifer may have aweight average molecular weight of approximately 200 to 5,000. A contentof the tackifier may be suitably controlled when necessary. For example,the tackifier may be included in the first layer at 5 to 100 parts byweight with respect to 100 parts by weight of the PSA component.

In addition to the components, various additives may be included in thefirst layer according to a use of the film and a process of forming thefilm. For example, in consideration of durability and processibility, acurable material may further be included in the first layer. Here, thecurable material may refer to a material having a heat-curablefunctional group and/or active energy ray-curable functional group whichare (is) included, in addition to the PSA component. In addition, acontent of the curable material included in the first layer may becontrolled according to a desired physical property of the film.

The second layer may includes an adhesive component. The second layermay be a hot melt-type adhesive layer. The term “hot melt-type adhesivelayer” used herein may refer to a layer which may maintain a solid orsemi-solid state at room temperature, may be melted when suitable heatis applied, thereby exhibiting a pressure-sensitive adhesive property,and may firmly fix a target material as an adhesive after curing. Inaddition, the term “curing of the adhesive” used herein may refer to achemical or physical action or reaction changing the target material tohave an adhesive property. In addition, the term “room temperature” mayrefer to a temperature in a natural state, which is not increased ordecreased, for example, approximately 15 to 35° C., 20 to 25° C., 25° C.or 23° C. In addition, here, the maintenance of a solid or semi-solidstate at room temperature may refer to the target material having aviscosity of approximately 10⁶ or 10⁷ poises or more at roomtemperature. Here, the viscosity is measured using an advancedrheometric expansion system (ARES). Here, the upper limit of theviscosity may be, but is not particularly limited to, for example,approximately 10⁹ poises or less.

For example, the second layer may maintain a solid or semi-solid stateat room temperature even in a state in which a component included in thesecond layer such as an adhesive component is uncured. Accordingly, thesecond layer may include the adhesive component in a film type. As aresult, excellent handleability may be obtained, physical or chemicaldamage to a diode during encapsulation may be prevented, and smoothworking may progress.

The adhesive component may be, for example, a curable resin. As thecurable resin, a heat-curable, active energy ray-curable orhybrid-curable resin known in the related art may be used. Herein, theterm “heat-curable resin” may refer to a resin which may be curedthrough application of suitable heat or aging, the term “active energyray-curable resin” may refer to a resin which may be cured by radiationof an active energy ray, and the term “hybrid-curable resin” may referto a resin which may be cured by simultaneously or sequentiallyperforming curing mechanisms for a heat-curable and active energyray-curable resins. In addition, the active energy ray may bemicrowaves, an IR, UV or X ray, a gamma ray, or a particle beam such asan alpha-particle beam, proton beam, neutron beam or electron beam.

The curable resin is a resin exhibiting an adhesive property aftercuring, and may include at least one heat-curable functional group orsite such as a glycidyl, isocyanate, hydroxyl, carboxyl or amide group,or at least one active energy ray-curable functional group or site suchas an epoxide, cyclic ether, sulfide, acetal or lactone group. Thecurable resin may be, but is not limited to, an acrylic resin, polyesterresin, isocyanate resin or epoxy resin having the at least onefunctional group or site described above.

In one example, the curable resin may be an epoxy resin. The epoxy resinmay be an aromatic or aliphatic epoxy resin. As the epoxy resin, aheat-curable epoxy resin, or an active energy ray-curable epoxy resin,which is cured by cationic polymerization by radiation of an activeenergy ray, may be used.

The epoxy resin according to one example may have an epoxy equivalent of150 to 2,000 g/eq. In the range of the epoxy equivalent, acharacteristic such as adhesive performance or a glass transitiontemperature of a cured product may be maintained in an appropriaterange.

In one example, the epoxy resin may be an aromatic epoxy resin. The term“aromatic epoxy resin” used herein may refer to an epoxy resin includingan aromatic core such as a phenylene structure or an aromatic group suchas a phenyl group in a main or side chain of the resin. When thearomatic epoxy resin is used, the cured product has excellent thermaland chemical stabilities and a low WVTR, and thus reliability of theencapsulating structure for an electronic diode may be enhanced. Thearomatic epoxy resin may be, but is not limited to, one or at least twoof a biphenyl-type epoxy resin, a naphthalene-type epoxy resin, adicyclopentadiene-type epoxy resin, a dicyclopentadiene-modifiedphenol-type epoxy resin, a cresol-based epoxy resin, a bisphenol-basedepoxy resin, a xylok-based epoxy resin, a multifunctional epoxy resin, aphenol novolac epoxy resin, a triphenolmethane-type epoxy resin and analkyl-modified triphenolmethane epoxy resin. In one example, the epoxyresin may be a silane-modified epoxy resin. The silane-modified epoxyresin may be, for example, a reaction product between at least one ofthe epoxy resins described above and a silane compound. Here, the silanecompound may be, for example, a compound represented by Formula 2.

D_(n)SiQ_((4-n))  [Formula 2]

In Formula 2, D is a vinyl group, an epoxy group, an amino group, anacryl group, a methacryl group, a mercapto group, an alkoxy group or anisocyanate group, or an alkyl group substituted with at least one of thefunctional groups, Q is hydrogen, an alkyl group, a halogen, an alkoxygroup, an aryl group, an aryloxy group, an acyloxy group, an alkylthiogroup or an alkyleneoxythio group, and n is a number between 1 and 3.

In the compound of Formula 2, the functional group D may form asilane-modified epoxy resin by a reaction with a functional groupincluded in the epoxy resin.

For example, when the functional group is an amino group, the aminogroup may form a bond “—CH(OH)—CH₂—NH—” by a reaction with an epoxygroup of the epoxy resin, and thus the silane compound may be introducedinto the epoxy group.

In addition, when the functional group D is an isocyanate or alkoxygroup, a silane compound may be introduced by a reaction with an epoxyresin including a hydroxyl (OH) group, for example, a bisphenol-typeepoxy resin such as a bisphenol F-type epoxy resin, a bisphenol F-typenovolac epoxy resin, a bisphenol A-type epoxy resin or a bisphenolA-type novolac epoxy resin.

In Formula 2, the alkyl group may be an alkyl group having 1 to 20, 1 to16, 1 to 12, 1 to 8 or 1 to 4 carbon atoms. The alkyl group may be alinear, branched or cyclic alkyl group.

In Formula 2, a halogen atom may be fluorine (F), chlorine (Cl), bromine(Br) or iodine (I).

In addition, in Formula 2, the alkoxy group may be an alkoxy grouphaving 1 to 20, 1 to 12, 1 to 8 or 1 to 4 carbon atoms. The alkoxy groupmay be a linear, branched or cyclic alkoxy group.

In addition, in Formula 2, the aryl group or aryl group included in thearyloxy group may be an aryl group or an aralkyl group. For example, thearyl group may refer to a monovalent residue derived from a compoundincluding at least one benzene ring or a structure in which at least twobenzene rings are linked or condensed or a derivative thereof. The arylgroup may be, for example, an aryl group having 6 to 25, 6 to 21, 6 to18 or 6 to 12 carbon atoms. As the aryl group, for example, a phenylgroup, a dichlorophenyl group, a chlorophenyl group, a phenylethylgroup, a phenylpropyl group, a benzyl group, a tolyl group, a xylylgroup or a naphthyl group may be used.

In addition, in Formula 2, the acyloxy group may be an acyloxy grouphaving 1 to 20, 1 to 16 or 1 to 12 carbon atoms.

In addition, in Formula 2, the alkylthio group may be an alkylthio grouphaving 1 to 20, 1 to 16, 1 to 12, 1 to 8 or 1 to 4 carbon atoms, thealkyleneoxythio group may be an alkyleneoxythio group having 1 to 20, 1to 16, 1 to 12, 1 to 8 or 1 to 4 carbon atoms.

The alkyl, alkoxy, aryl, acyloxy, alkylthio or alkyleneoxythio group maybe optionally substituted with at least one substituent. The substituentmay be, but is not limited to, a hydroxyl group, an epoxy group, analkyl group, an alkenyl group, an alkynyl group, an alkoxy group, anacyl group, a thiol group, an acryloyl group, a methacryloyl group, anaryl group or an isocyanate group.

In Formula 2, the functional group D may be, for example, an alkoxygroup, an amino group or an isocyanate group among these.

In addition, in Formula 2, at least one, two or three of the functionalgroups Q may be, for example, a halogen atom, an alkoxy group, anaryloxy group, an acyloxy group, an alkylthio group or analkyleneoxythio group, or an alkoxy group.

As the silane-modified epoxy group, for example, an epoxy resin intowhich a silane compound is introduced at approximately 0.1 to 10 partsby weight, 0.1 to 9 parts by weight, 0.1 to 8 parts by weight, 0.1 to 7parts by weight, 0.1 to 6 parts by weight, 0.1 to 5 parts by weight, 0.1to 4 parts by weight, 0.1 to 3 parts by weight, 0.3 to 2 parts by weightor 0.5 to 2 parts by weight with respect to 100 parts by weight of theepoxy resin. In one example, the epoxy resin to which the silanecompound is introduced may be an aromatic epoxy resin. The aromaticepoxy resin may be, for example, a bisphenol-type epoxy resin such as abisphenol F-type epoxy resin, a bisphenol F-type novolac epoxy resin, abisphenol A-type epoxy resin or a bisphenol A-type novolac epoxy resin.

Due to the epoxy resin which is modified by a silane to include a silylgroup in its structure, the encapsulating layer of an electronic devicemay have an excellent adhesive property to a substrate, etc., andexcellent moisture blocking property, durability and reliability.

The second layer may further include a curing agent which may form acrosslinking structure by a reaction with a curable resin or aninitiator which may initiate a curing reaction of the resin depending onthe kind of the curable resin.

A suitable kind of the curing agent may be selected and used accordingto the kind of the curable resin or a functional group included in theresin.

In one example, when the curable resin is an epoxy resin, as a curingagent, a curing agent for the epoxy resin known in the related art maybe used, and may be, but is not limited to, one or at least two of anamine curing agent, an imidazole curing agent, a phenol curing agent, aphosphorus curing agent or an acid anhydride curing agent.

In one example, as the curing agent, an imidazole compound which issolid at room temperature and has a melting point or decompositiontemperature of 80° C. or more may be used. Such a compound may be, butis not limited to, 2-methyl imidazole, 2-heptadecyl imidazole, 2-phenylimidazole, 2-phenyl-4-methyl imidazole or 1-cyanoethyl-2-phenylimidazole.

A content of the curing agent may be selected according to a compositionof the composition, for example, a kind or ratio of the curable resin.For example, the curing agent may be included at 1 to 20, 1 to 10 or 1to 5 parts by weight with respect to 100 parts by weight of the curableresin. However, the weight ratio may be changed according to the kindand ratio of a curable resin or a functional group of the resin, or acrosslinking density to be realized.

When the curable resin is an epoxy resin which may be cured by radiationof an active energy ray, as an initiator, for example, a cationicphotoinitiator may be used.

The cationic photoinitiator may be an onium salt or organometallicsalt-based ionized cationic initiator or an organic silane or latentsulfonic acid-based non-ionized cationic photoinitiator. The oniumsalt-based initiator may be a diaryliodonium salt, a triarylsulfoniumsalt or an aryldiazonium salt, the organic metal salt-based initiatormay be an iron arene, the organic silane-based initiator may be ano-nitrobenzyl triaryl silyl ether, a triaryl silyl peroxide or an acylsilane, and the latent sulfonic acid-based initiator may beα-sulfonyloxy ketone or α-hydroxymethylbenzoin sulfonate, but thepresent invention is not limited thereto.

In one example, the cationic initiator may be an ionized cationic photoinitiator.

A content of the initiator may be changed according to the kind andratio of a curable resin or a functional group of the resin, or acrosslinking density to be realized like the curing agent. For example,the initiator may be blended at a content of 0.01 to 10 parts by weightor 0.1 to 3 parts by weight with respect to 100 parts by weight of thecurable resin. When the content of the curing agent is excessivelysmall, curing may not be sufficiently performed, and when the content ofthe curing agent is excessively high, a content of an ionic material isincreased after curing, and thus the durability of the adhesive isdegraded or a conjugate acid is formed due to the characteristic of theinitiator, which is inappropriate for optical durability. In addition,depending on a base, corrosion may occur, and therefore a suitablecontent range may be selected.

The second layer may further include a binder resin. The binder resinmay serve to improve moldability when molded in a film or sheet type.

The kind of a binder resin is not particularly limited if a resin has acompatibility with a different resin such as a curable resin. The binderresin may be a phenoxy resin, an acrylate resin or a high molecularweight epoxy resin. Here, the high molecular weight epoxy resin mayrefer to a resin having a weight average molecular weight ofapproximately 2,000 to 70,000 or 4,000 or 6,000. The high molecularweight epoxy resin may be a solid bisphenol A-type epoxy resin or asolid bisphenol F-type epoxy resin. As the binder resin, a rubbercomponent such as a high-polarity functional group-containing rubber ora high-polarity functional group-containing reactive rubber may be used.In one example, the binder resin may be a phenoxy resin.

When the binder resin is included, its ratio may be controlled accordingto a desired physical property, but is not particularly limited. Forexample, the binder resin may be included at a content of approximately200, 150 or 100 parts by weight with respect to 100 parts by weight of acurable adhesive component. When the content of the binder resin is 200parts by weight or less, a compatibility with each component of thesecond layer may be effectively maintained, and the binder resin mayserve as an adhesive layer.

The second layer may further include a moisture blocker. When themoisture scavenger is in contact with a diode including an organicmaterial, it may damage the diode by a chemical reaction with moisture.Accordingly, the second layer may or may not include a trace amount ofthe moisture scavenger. When the second layer includes a trace amount ofthe moisture scavenger, a content of the moisture scavenger may be asdescribed above. However, the moisture blocker makes a migration pathfor moisture longer to block moisture, and since it has a smallerreactivity than the moisture scavenger, it has a lower chance ofdamaging the diode. A content of the moisture blocker which may beincluded in the second layer may be, for example, approximately 0.01 to50 parts by weight or 1 to 30 parts by weight based on 100 parts byweight of the curable resin. A particular kind of the moisture blockerand a method of dispersing the moisture blocker in the curable resin maybe understood with reference to the moisture blocker included in thefirst layer and the method of including the moisture blocker.

The second layer may further include an additive such as a plasticizingagent, a UV stabilizer and/or an antioxidant without affecting a desiredeffect.

The film may further include a base. The base may be disposed on one orboth surfaces of the film. The base may be, for example, arelease-treated base, or any one used in the related art withoutlimitation.

The encapsulating film may encapsulate and protect various targets.Particularly, the film may be applied to manufacturing a targetincluding a diode sensitive to an external component, for example,moisture or vapor.

Hereinafter, a method of manufacturing an electronic device by using thefilm. As an example of the electronic device to which the encapsulatingfilm may be applied, an organic electronic device such as a photovoltaicdevice, a rectifier, a transmitter or an OLED, a solar cell or asecondary battery may be used, but the present invention is not limitedthereto.

The method of manufacturing an electronic device includes laminating thefilm on a diode such that a second layer of the film is in contact withthe diode. Here, the diode may refer to any one part of the electronicdevice.

In one example, the laminating of the second layer of the film to be incontact with the diode may include contacting the second layer with thediode. The second layer of the film, for example, may be applied so thatthe film may cover an entire surface of the diode. When film may beapplied to cover an entire surface of the diode, the diode cannot bedetected from a top view and the entire surface of the diode can beprotected from moisture. In addition, as described above, since thesecond layer includes a trace amount of or no moisture scavenger capableof damaging the diode, it does not influence a function even when thesecond layer is in contact with the diode.

In another example, when the diode is formed on a bottom substrate, thesecond layer of the film may be applied to cover an entire surface ofthe diode and at least a part of the bottom substrate. For example,applying the film to cover at least a part of the bottom substrate mayperform such that the film covers an entire surface of the diode and thebottom substrate along an edge of the diode by forming the film and thebottom substrate bigger than the diode. In addition, as described above,the second layer has a step difference compensating property, and thusmay be attached to a surface having a height difference such as thebottom substrate having the diode without lifting and/or bubbles. As aresult, the electronic device having an excellent interface adhesivestrength between the film, the diode and bottom substrate may beprovided.

In one example, the laminating of the second layer of the film to be incontact with the diode may include contacting the second layer with thediode and heating the resulting layer. The laminating, for example, mayperform by contacting the second layer and diode and pressing the diodewhile the second layer is heated to provide flowability. In one example,the second layer may be solid or semi-solid at room temperature, and maybe heated to maintain a viscosity of 10³ to 10⁵ Pa·s at 65° C. and 1 Hzwhen the second layer is in contact with the diode. When the secondlayer is the above-described hot melt-type adhesive layer, it may beattached to a surface having a height difference such as the substrateon which the diode is formed without lifting and/or bubbles.Accordingly, even a large-scale electronic device may be providedwithout degradation in performance due to bubbles.

Here, when the second layer includes a heat-curable resin, the heatingmay be controlled to a temperature within approximately 40 to 100° C.and a time within 1 to 20 minutes since a cohesive strength and anadhesive strength of the encapsulating layer may be decreased due toovercuring.

In addition, the pressing may be performed in a vacuum state to preventbubbles from being generated between the diode and the second layer. Inone example, the laminating of the second layer to be in contact withthe diode may be performed using a vacuum press.

In addition, the method may include curing the second layer after thesecond layer is stacked to be in contact with the diode. The curingprocess may be performed in a suitable heating chamber or UV chamberdepending on, for example, a method of curing a curable resin. Heatingconditions or conditions for radiating an active energy ray may besuitably selected in consideration of stability of the electronic diodeand curability of a curable resin composition.

In one example, the curing may be performed such that the second layerhas a glass transition temperature of 0° C., 50° C., 70° C., 85° C. or100° C. or more. Since the first layer may include large amounts of themoisture scavenger, ions generated by a reaction between the moisturescavenger and moisture may migrate to the second layer. However, thesecond layer may be in contact with the diode, and thus the ionsmigrating from the first layer to the second layer may influenceperformance of the diode. For this reason, the second layer may besufficiently cured, thereby preventing the migration of the ions fromthe first layer to the second layer, and deterioration of theperformance of the diode. That is, the second layer may have theabove-described effects by preventing the migration of the ions having aglass transition temperature within in the above range from the firstlayer to the second layer. That is when the curing is performed suchthat the second layer has the above range of a glass transitiontemperature, it can prevent the migration of ions from the first layerto the second layer, and thus the above-described effects can beexhibited.

In one example, the film may be pre-transferred to the upper substrateof the electronic device before laminating. As shown in FIG. 2, the film24 includes a first layer 12 and a second layer 11, the first layer 12of the film may be transferred to an upper substrate 21. In one example,when the first layer 12 has a pressure-sensitive adhesive property, itmay be attached to the upper substrate 21 by a predetermined pressure.Accordingly, the transfer of the first layer may be performed by rolllamination after the first layer is in contact with the upper substrate21. Afterward, as described above, the second layer 11 of the film maybe stacked on the diode 23.

An electronic device which includes an upper substrate 21; a bottomsubstrate 22; and a film encapsulating a diode between the upper andbottom substrates may be provided by the method as described above.

In one example, the method of manufacturing an electronic device may beapplied to manufacturing an organic electronic device. An encapsulatinglayer formed by curing the film may exhibit excellent moisture blockingproperty and optical properties in the organic electronic system, andeffectively fix and support the upper substrate and the bottomsubstrate. In addition, the encapsulating layer may have excellenttransparency since the moisture scavenger is prepared in a nano size anduniformly dispersed in the resin, and thus become stable regardless of ashape of the organic electronic system such as a top emission or bottomemission type.

The method may be provided in a conventional configuration known in therelated art except that an organic light emitting diode is encapsulatedby the above film. For example, in order to prepare a bottom substrateon which OLED is formed, a transparent electrode may be formed on asubstrate such as a glass, metal or polymer film by using vacuumdeposition or sputtering, and a layer of an organic material may beformed on the transparent electrode. The layer of an organic materialmay include a hole injection layer, a hole transport layer, an emittinglayer, an electron injection layer and/or an electron transport layer.Subsequently, the bottom substrate on which OLED is formed may beprepared by further forming a second electrode on the layer of anorganic material. An organic electronic device may be manufactured byusing the bottom substrate to which OLED is formed as mentioned above.

The method described above is an example of the method of manufacturingan electronic device, but the present invention is not limited thereto.The process of manufacturing the device may be performed as describedabove, but a sequence or conditions of the process may be changed.

EFFECT

An electronic device having excellent moisture blocking property anddurability may be provided by the method.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram of a film according to an exemplaryembodiment; and

FIG. 2 is a schematic diagram illustrating a method of manufacturing anelectronic device according to an exemplary embodiment.

DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS

Hereinafter, a method of manufacturing an organic device will bedescribed in further detail with reference to Examples and ComparativeExamples, but the scope of the method is not limited to the followingExamples.

Hereinafter, physical properties shown in Examples and ComparativeExamples are evaluated by the following methods.

1. Measurement of Contact Angle

A contact angle was measured with respect to a coating layer formed bypreparing a solution having a solid content of 15 wt % by dissolving abase resin in a dilutable solvent, coating the prepared solution on aglass to have a thickness of 10 nm and drying the coated solution.Particularly, the contact angle was measured using DSA100 produced byKRUSS. Deionized water was dropped to the coating layer at approximately25° C., which was repeated 10 times, and then an average of the measuredresults was determined as the contact angle.

2. Measurement of WVTR

A resin composition was prepared by dissolving the component for thefirst layer used in Example or the resin used in Comparative Example ina solvent. The resin composition was coated on a base film (releasingpolyester film, RS-21G, SKC) having a thickness of 38 μm. Subsequently,the coated composition was dried at 110° C. for 10 minutes, and therebya film-type layer having a thickness of 100 μm was prepared. Afterward,the base film was detached, the film-type layer was maintained at 100°F. and a relative humidity of 100%, and then a WVTR with respect to athickness direction of the film-type layer was measured. The WVTR wasmeasured as prescribed in regulations of ASTM F1249.

3. Measurement of Tensile Modulus

A resin composition was prepared by dissolving a first or second layerprepared in Example or Comparative Example in a solvent. The resincomposition was coated on a base film (releasing polyester film, RS-21G,SKC) having a thickness of 38 μm. Subsequently, the coated compositionwas dried at 110° C. for 10 minutes, and thereby a film-type layerhaving a thickness of 40 μm was prepared. The prepared coating layer wasdesigned to be coated in a length direction, and then cut in a size of50 mm×10 mm (length×width), thereby preparing a specimen. Both terminalends of the specimen were taped to leave 25 mm in a length direction.Subsequently, while the taped part was extended at 25° C. at a rate of18 mm/min, a tensile modulus was measured.

4. Evaluation of Moisture Blocking Property

While a specimen formed in Example or Comparative Example was maintainedin a constant temperature and constant humidity chamber at 85° C. and arelative humidity of 85% for approximately 500 hours, a length of thecalcium-deposited part which was oxidized and made transparent wasmeasured. Since calcium had a total length in one direction of 10 mm,the length of the oxidized part of the calcium from one terminal endbecame 5 mm, which meant that all of the calcium was oxidized.

5. Evaluation of Durability and Reliability

While a specimen formed in Example or Comparative Example was maintainedin a constant temperature and constant humidity chamber at 85° C. and arelative humidity of 85% for approximately 500 hours, it was observedwhether or not lifting occurred at an interface between the glasssubstrate and the encapsulating layer.

6. Evaluation of Applicability of Panel

It was observed with the unaided eye whether or not bubbles weregenerated in a specimen formed in Example or Comparative Example.

Example 1 (1) Preparation of Encapsulating Film

1) Preparation of First Layer Solution

A moisture scavenger solution was prepared by adding 100 g of calcineddolomite as a moisture scavenger and 0.5 g of stearic acid as adispersing agent to a toluene to have a solid content of 50 wt %. Inaddition, separately, 65 g of a polyisobutene resin (weight averagemolecular weight of 450,000) and 5 g of a maleic acid anhydride-gratedstyrene-ethylene-butadiene-styrene block copolymer (MA-SEBS, ProductName: FG-1901X, Manufacturer: Kraton) were added as base resins for thefirst layer to a reaction vessel at room temperature, and 30 g of ahydrogenated dicyclopentadiene-based resin (softening point: 125° C.)was added thereto as a tackifier and diluted with toluene to have asolid content of approximately 20 wt %. The previously prepared moisturescavenger solution was added to the solution to have a content of thecalcined dolomite of 30 parts by weight with respect to 100 parts byweight of the base resins for the first layer, and mixed together,thereby preparing a first layer solution.

2) Preparation of Second Layer Solution

200 g of a silane-modified epoxy resin (KSR-177, Kukdo Chemical) and 150g of a phenoxy resin (YP-50, Tohto Kasei) were added to a reactionvessel at room temperature, and then diluted with methylethylketone. 4 gof imidazole (Shikoku Chemical) which was a curing agent was added tothe homogenized solution, and stirred at a high speed for 1 hour,thereby preparing a second layer solution.

3) Formation of Film

A first layer was formed to have a thickness of 40 μm by coating thesolution of a first layer prepared above on a release surface ofreleasing PET and drying the coated solution at 110° C. for 10 minutes.

A second layer was formed to have a thickness of 15 μm by coating thesolution of a second layer prepared above on a release surface ofreleasing PET and drying the coated solution at 130° C. for 3 minutes.

A multilayer film was formed by laminating the first and second layers.

(2) Preparation of Specimen

Calcium (Ca) was deposited on a glass substrate having a size of 12mm×12 mm (length×width) to have a size of 10 mm×10 mm (length×width).Separately, a film formed in the above was cut to a size of 12 mm×12 mm(length×width). Subsequently, the first layer of the film wastransferred to a cover glass. Afterward, an opposite surface to that ofthe film on which the cover glass was disposed was laminated on thecalcium of the glass substrate, and thermally pressed using a vacuumpress at 80° C. for 2 minutes, and cured at 100° C. for 3 hours, therebyforming an encapsulating layer. Thus, a specimen was manufactured.

Example 2

A film and a specimen were prepared as described in Example 1, exceptthat 60 g of polyisobutene and 10 g of MA-SEBS were used instead of 65 gof polyisobutene and 5 g of MA-SEBS as PSA component of the first layerof the film.

Example 3

A film and a specimen were prepared as described in Example 1, exceptthat 55 g of polyisobutene and 15 g of MA-SEBS were used instead of 65 gof polyisobutene and 5 g of MA-SEBS as PSA component of the first layerof the film.

Example 4

A film and specimen were prepared as described in Example 2, except thata styrene-butadiene-styrene block copolymer (SBS, Product Name: D-1101,Manufacturer: Kraton) was used instead of MA-SEBS of the PSA componentsfor the first layer.

Example 5

A film and specimen were prepared as described in Example 2, except thata styrene-isoprene-styrene block copolymer (SIS, Product Name: D-1107,Manufacturer: Kraton) was used instead of MA-SEBS of the PSA componentsfor the first layer.

Example 6

A film and specimen were prepared as described in Example 2, except that70 g of a polyisobutene resin was used instead of 60 g of apolyisobutene resin and 10 g of MA-SEBS as PSA components for the firstlayer.

Comparative Example 1

A specimen was prepared as described in Example 1, except that a secondlayer of a film was in contact with an upper substrate.

Comparative Example 2

A specimen was prepared as described in Example 1, except that a bottomsubstrate having calcium was in contact with a second layer of the filmbefore a first layer was attached to an upper substrate, and thenthermally pressed and cured.

TABLE 1 Contact Angle^(a) WVTR^(b) M1^(c) M2^(d) Tg 1^(e) Tg 2^(f)EXAMPLE 1 108 7.8 0.5 680 −60 101 2 103 7.8 0.71 680 −57 101 3 101 41.00.76 680 −55 101 4 110 10.0 0.6 680 −62 101 5 109 9.3 0.69 680 −59 101 6111 3.2 0.5 680 −65 101 ^(a)Contact Angle (Unit: °) of PSA component ofFirst Layer ^(b)WVTR (Unit: g/m² · day) of PSA component of First Layer^(c)Tensile Modulus (Unit: MPa) of First Layer ^(d)Tensile Modulus(Unit: MPa) of Second Layer ^(e)Glass Transition Temperature (Unit: °C.) of PSA component of First Layer After Curing ^(f)Glass TransitionTemperature (Unit: ° C.) of Adhesive component of Second Layer AfterCuring *C. EXAMPLE: Comparative Example

TABLE 2 Moisture Blocking Durability and Possibility Property^(g)Reliability to Apply Panel EXAMPLE 1 2.7 Good No Bubbles 2 3.1 Good NoBubbles 3 3.3 Good No Bubbles 4 2.8 Good No Bubbles 5 2.8 Good NoBubbles 6 2.5 Good No Bubbles C. 1 2.4 Destroyed Bubbles EXAMPLE 2 2.7Good Bubbles ^(g)Length of calcium oxidized in one direction from onesurface (Unit: mm) *C. EXAMPLE: Comparative Example

What is claimed is:
 1. A method of manufacturing an electronic device,comprising: laminating an encapsulating film in which a first layerincluding a pressure-sensitive adhesive component and a second layerincluding an adhesive component are stacked on a diode such that thesecond layer is in contact with the diode.
 2. The method according toclaim 1, wherein the laminating of the second layer to be in contactwith the diode includes contacting the second layer with the diode andheating the resulting layer.
 3. The method according to claim 2, whereinthe second layer is in contact with the diode to cover an entire surfaceof the diode.
 4. The method according to claim 3, wherein the diode isformed on a bottom substrate and the second layer is in contact with thediode to cover an entire surface of the diode and at least a part of thebottom substrate.
 5. The method according to claim 2, wherein the secondlayer is solid or semi-solid at room temperature, and heated to maintaina viscosity of 10³ to 10⁵ Pa·s at the time to be in contact with thediode.
 6. The method according to claim 2, wherein the heating isperformed at 40 to 100° C.
 7. The method according to claim 1, whereinthe laminating of the second layer on the diode to be in contact withthe diode is performed in a vacuum state.
 8. The method according toclaim 7, wherein the laminating of the second layer on the diode to bein contact with the diode is performed using a vacuum press.
 9. Themethod according to claim 1, further comprising: curing the second layerafter the second layer is laminated on the diode to be in contact withthe diode.
 10. The method according to claim 9, wherein the curing ofthe second layer is performed such that the second layer has a glasstransition temperature of 0° C. or more after curing.
 11. The methodaccording to claim 1, further comprising: transferring the first layerto the upper substrate before the second layer is laminated on the diodeto be in contact with the diode.
 12. The method according to claim 11,wherein the transferring of the first layer to the upper substrate isperformed by contacting the first layer with the upper substrate andperforming roll lamination.
 13. The method according to claim 1, whereinthe diode is an organic light emitting diode.